硬體部分

1.  PC板之堆疊順序

NO.	6  Layers	8  Layers	10  Layers	12  Layers
1	Middle speed	Middle speed	Middle speed	Middle speed
2	CLK & High speed	GND	GND	GND
3	GND	CLK & High speed	CLK & High speed	CLK & High speed
4	Vcc	GND	CLK & High speed	CLK & High speed
5	Others	Vcc	GND	CLK & High speed
6	CLK & High speed	CLK & High speed	Vcc	GND
7		GND	Others	Vcc
8		Others	CLK & High speed	Others
9			GND	CLK & High speed
10			Middle speed	CLK & High speed
11				GND
12				Middle speed

    Remark: 1. CLK & High speed: 30MHz以上.

           2. Middle speed: 10—30MHz.

           3. Others: 10MHz以下.

2. PC板應保持完整性, 以正方形或長方形為最佳, 避免有缺口或不規則.

3. PC應以一塊為最佳, 避免多塊組合.

4. PC板之板邊應有3mm以上之trace來圍繞,Ground trace以10-15mm的距離,並以random方式加through hole.

5. PC板之板邊應有3mm以上之trace來圍繞,並加SMD Finger與PC板下之金屬表面接觸.

1.      ALL signals應與板邊GND Trace及固定孔之距離為2mm.

2.      Mother board上,至少要有7個以上之固定孔,並力求平衡,不要集中在一處.而其他區域則無螺絲孔可供下地,此螺絲孔應靠近I/O connector及VGA IC, Clock generator, DC IN.

3.      All PC板之固定孔,必須導通,不能將PAD除掉.

4.      Glide Pad的PC板上之signal line務必包地.

5.      每一I/O Chip set,需要放置在I/O Port之最近位置.VGA port & TV port & S terminal port需放置在一起.

6.      All I/O ports之GND plane要切割.

7.      VGA chip & Clock Generator務必將GND給予切割.

8.      ALL I/O ports之EMI components,分別以2mm之距離,靠近I/O connector位置.

9.      ALL I/O connector之固定腳PAD,再加2mm.

10.  高速訊號線& Clock trace應放至內層,並靠近GND Plane.

11.  Clock trace若無法包地,其Trace & Trace之spacing是Trace的兩倍.

12.  Clock generator and Main chip set在placement時不可放在板邊,應放置在中間.

13.  各chip set的信號線,其trace越短越好,clock trace須包地,頻率越高,trace越短.

14.  各chip set的信號線在走線時,不可平行重疊在一起,須垂直走線.

15.  LAN & MODEM Jack至Connector之trace,其附近之每一層,不宜走線,並且Connector之外5mm應掏空.

16.  Modem & LAN card, Combo card with Modem & LAN應儘量靠近LAN & Modem Jack connector. Modem & LAN Cable應走板邊,並避開DC/DC components & High Frequency components.

17.  若ESD可直接打入訊號點,則應予以絕緣包之或圍Ground Trace做保護.